Semiconductor heat dissipation: Using a large heat dissipation pad and utilizing semiconductor technology to greatly improve heat dissipation performance. Built-in large heat sink, it cools down immediately when the power is turned on, without waiting to avoid overheating, ensuring a stable live broadcast or gaming experience.
Magnetic design: The magnetic sheet is composed of high thermal conductivity steel plate and strong adhesive, and can be used for a long time after a single installation. The radiator will automatically absorb when approached and will not fall off during use.
Choose the right temperature based on the type of game and the heat generated by your phone to create a long-lasting and smooth gaming environment.
High thermal conductivity, large area heat dissipation, 360° annular cooling air, greatly improves thermal conductivity and better heat dissipation effect.
Fine structural design, using TEC semiconductor refrigeration chip, reasonable and healthy heat dissipation, without damaging the mobile phone.
Charging Type | Type-C |
Colour Name | Multicolour |
Product Length | 10 cm |
Product Width | 10 cm |
Number of pieces | 1 |
Product Weight | 160 g |
Connection Type | USB Type C |
Product Height | 3 cm |
Model Name | SZYML-385 |