Specification:
Item Type: Low Temperature Flux Paste
Model: SFD-231
Composition: Sn42 Bi58
Granules: 25-45um (No.3 powder)
Weight: 45g/Pcs with Tube
Applicable: Mobile phone CPU IC, etc.
Melting Point: 138℃
Material: Tin
Package List:
1 x Low Temperature Flux Paste
Product Weight | 500 g |
What's In The Box | Low Temperature Flux Paste Solder Flux Tin Paste Soldering Grease Gel Solder Paste CPU Repairs Tool |
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