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Low Temperature Flux Paste Solder Flux Tin Paste Soldering Grease Gel Solder Paste CPU Repairs Tool

254.90
Inclusive of VAT
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Product Overview
Highlights
  • Less Residue: Full and bright tin beads on tin, less residue, white and transparent, no fluorine and other extremely corrosive substances
  • Easy to Use: This low temperature solder paste has good wetting and mold release, and is resistant to cold slump, hot slump and drying
  • Basic Specifications: The particles are 25‑45um (No. 3 powder), the ingredients are Sn42, Bi58, used for mobile phone CPU IC, etc.
  • High Performance: Has strong continuous printing performance, suitable for fine pitch IC and BGA and relatively accuracy components welding
  • Application: Suitable for PCB welding of various high demand materials, and rarely phenomenons of tin tombstone displacement
Overview

Specification:
Item Type: Low Temperature Flux Paste
Model: SFD-231
Composition: Sn42 Bi58
Granules: 25-45um (No.3 powder)
Weight: 45g/Pcs with Tube
Applicable: Mobile phone CPU IC, etc.
Melting Point: 138℃
Material: Tin

Package List:
1 x Low Temperature Flux Paste

Specifications
Product Weight500 g
What's In The BoxLow Temperature Flux Paste Solder Flux Tin Paste Soldering Grease Gel Solder Paste CPU Repairs Tool
Cart Total  254.90

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