معجون حراري CryoFuze فائق الأداء، جسيمات نانوية، موصلية وحدة المعالجة المركزية/وحدة معالجة الرسومات W/mk= 14 م، غير قابل للتآكل، درجة الحرارة -50 درجة مئوية حتى 250 درجة مئوية لمبردات وحدة المعالجة المركزية ووحدة معالجة الرسومات

نظرة عامةCryoFuze Close Cold Contact Cooler Master is launching CryoFuze, the all new line of thermal paste delivering superior bonding for your processing capabilities. Utilizing nanoparticles, CryoFuze allows for excellent thermal conductivity on all processing components for optimal heat transfer. The non-corrosive and oxidation resistant properties prevent solidification and leaves metal contact surfaces unharmed. Versatile range of temperature performance, maintaining stability from -50°C up to 250°C. High Performance Exceptional Thermal Conductivity Anhygroscopic (Non Moisture Absorbent) Non-Corrosive Formula Temperature stability from -50°C up to 250°C. Stable Performance Easy Application Nanoparticles Exceptional Conductivity Non-Corrosive Formula Exceptional Thermal Easy Application Exceptional Conductivity Thermal conductivity matching K value cooling requirements of 14W/mK handles even the most extreme builds. Non-Corrosive Formula Non-corrosive, oxidation-resistant properties leaves metal surfaces unharmed and does not solidify. Versatile temperature stability from -50°C up to 250°C.Non-corrosive Exceptional Thermal Utilizing nanoparticles for superior heat conductivity for your CPU or GPU. Easy Application Viscously balanced formula allow for easy application and clean up.