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Cooling Thermal Pad, KASTWAVE Blue Soft Silicone Thermal Conductive Pads Heatsink IC Chipset Fit for Northbridge SSD CPU GPU LED Cooling Soft insulating gasket silicone thermal pad (100pcs 10x10x1mm)

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Product Overview
Highlights
  • ♥ 【PRODUCT SPECIFICATION】: Dimension: 10x10mm, thickness: 1.0mm, thermal conductivity: 1.5w/m-K, material: conduction silicone, color: blue.
  • ♥ 【GOOD HEAT DISSIPATION】: Perfect to filled contact surfaces gap, effectively improve the heat transfer efficiency, improve the heat transfer between the CPU / chipset / motherboard / module and the heat sink, and also serve as insulation, shock abs
  • ♥ 【EASY & CONVENIENT TO USE】: It can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
OverviewA great assistant for heat transferring:
●1.5 W/mK thermal conductivity for fast heat transferring in short time.
●High temperature performance in -40 ℃ - 200 ℃ will not melt.
●Contact with any electrical traces wouldn’t result in damage of any sort.
●Non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation.

Safe To Use:

The thermal pad ; doesn’t ; contain any metal particles, electrically insulated and not capacitive, very safe to use.
Dimension 10x10x1.0mm, the thermal pads can be cut freely to any sizes and perfect to filled contact surfaces gap.

Widely application for:

●Electronic products, motherboard, motor, external pad and foot pad, electronic, appliances, high LED lighting, Car machine.
●Devices, automotive electronic modules (engine scrubber) modules, high supplies.
●Computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives), laptop and any electronic equipment needing to be filled with heat dissipation.

Package Content:

100pcs10x10x1.0mm Thermal Pad

The thermal pads fill the air gap between the heat-generating device and the heat sink or metal base.
With the characteristics of softness and elasticity, the thermal pads can cover very incomplete surfaces.
Heat can be conducted from the internal device to the metal shell or the heat sink plate.
Improve the efficiency and service life of heating electronic components.
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