Highlights
Rapid Cooling: Utilizes semiconductor refrigeration technology to quickly reduce phone temperature by up to 35°C.
Magnetic Attachment: Securely and easily attaches to the back of your smartphone for convenient use.
Large Cooling Area: Features a 107% larger cooling area compared to previous models for efficient heat dissipation.
Powerful Fans: Equipped with high-speed fans to accelerate heat transfer and improve device performance.
RGB Lighting: Customizable RGB lighting effects for a personalized gaming experience.
Overview
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