UV80 غير نظيفة لحام لحام لصق الجريان للإلكترونيات PCB BGA PGA SMD أداة لحام

الميزات الأساسية

• High bond strength, good insulation, smooth welding surface. Melting point is slightly higher than soldering tin
• No-clean solder paste with minimal residue and no cleaning required
• Great soldering work tool for mobile phone, PCB, BGA, SMD, electronic repair
• Model: UV80, Weight with case: approx 50g; Case Size: 7.7 x 2.5 cm